Requirements1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science or equivalent2) Min 3 years' experience in Discrete or Module semiconductor die attach or SMT engineering using ASM, ESEC, Yamaha(SMT), Datacon, others die bonder or SMT machine experience3) Solder and epoxy material properties and its reliability failures knowledge 4) JMP, Minitab DOE or other statistical analysis skill will get advantages5) Be familiar with design, process FMEA, Control plan generation6) In-depth knowledge of power electronic packages and processes7) Fundamental understanding of package design and material properties8) Knowledge of power packages processes 9) Understanding of semiconductor material properties and their influence on semiconductor device behavior10) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired11) Excellent interpersonal, verbal, and written English communication skills12) Ability to demonstrate great attention to detail13) Are a proven self-starter
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